creat by art ? glass passivated junction chip ? for surface mounted application ? low profile package ? built-in strain rellef ? ideal for automated placement ? easy pick and place ? ultra fast recovery time for high efficiency esh1b sma 1.8k / 7" reel r3 maximum ratings and el ectrical characteristics rating at 25 ambient temperature unless otherwise specified. single phase, half wave, 60 hz, resistive or inductive load. for capacitive load, derate current by 20% symbol unit v rrm v v rms v v dc v i f(av) a trr ns cj pf t j o c t stg o c version:b13 note 2: reverse recovery test conditions: i f =0.5a, i r =1.0a, i rr =0.25a note 3: measured at 1 mhz and applied reverse voltage of 4.0v d.c. o c/w operating temperature range - 55 to + 175 storage temperature range - 55 to + 175 note 1: pulse test with pw=300 usec, 1% duty cycle maximum reverse recovery time (note 2) 15 typical junction capacitance (note 3) 16 typical thermal resistance r ja r jl 85 35 maximum instantaneous forward voltage (note 1) @ 1.0a v f 0.95 v maximum reverse current @ rated vr t a =25 t a =125 i r 1 ua 25 maximum average forward rectified current 1.0 peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 30 a maximum rms voltage 70 105 140 maximum dc blocking voltage 100 150 200 r3g type number esh1b esh1c esh1d maximum repetitive peak reverse voltage 100 150 200 ? packing: 12mm tape per eia std rs-481 ? weight: 0.064 grams ordering information (example) part no. package packing packing code packing code (green) ? plastic material used carries underwriters laboratory classification 94v-0 ? green compound with suffix "g" on packing code & prefix "g" on datecode mechanical data ? case: molded plastic ? terminals: pure tin plated, lead free ? polarity: indicated by cathode band esh1b - esh1d 1.0amp surface mount ultra fast rectifiers sma/do-214ac features ? high temperature soldering: 260 /10 seconds at terminals ? meet msl level 1, per j-std-020d lead free, maximum peak of 260
version:b13 ratings and characteristic curves (esh1b thru esh1d) 0 0.2 0.4 0.6 0.8 1 1.2 75 85 95 105 115 125 135 145 155 165 175 average forward current (a) lead temperature ( o c) fig.1 forward current derating curve resister or inductive load 0 5 10 15 20 25 30 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 2 maximum non-repetitive forward surge current 8.3ms single half sine wave jedec method ta=25 0.1 1 10 100 1000 0 20 40 60 80 100 120 140 instantaneous reverse current (ua) percent of rated peak reverse voltage (%) fig. 4 typical reverse characteristics ta=25 ta=125 ta=75 1 10 100 0.1 1 10 100 capacitance (pf) reverse voltage (v) fig. 5 typical junction capacitance ta=25 0.1 1 10 100 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 instantaneous forward current (a) forward voltage (v) fig. 3 typical forward characteristics ta=25 pulse width=300us 1% duty cycle
sma r3 sma r2 sma m2 folded sma f3 folded sma f2 folded sma f4 c sma e3 c sma e2 tape & reel specification abcdngt 2.0 0.4 +0.5;-0.2 min 1.0 +0.8;-0 max 7" 12mm 178 1.9 13 21 62 12.2 14.6 abcdngt max 0.5 0.5 min 0.5 +2.0;-0 max 13" 12mm 330 2 13 20.2 75 12.4 18.4 unit (mm) note: "x" is device code from "b" thru "d". reel size tape size reel size tape size f2g 7.5k / 13" plastic reel f4g 1.8k / 7" reel e3g 7.5k / 13" reel e2g esh1x (note) 1.8k / 7" reel r3g 7.5k / 13" reel r2g 7.5k / 13" plastic reel m2g 1.8k / 7" reel f3g 7.5k / 13" reel ordering information part no. package packing packing code packing code (green)
symbol a b c d e min max min max a 1.27 1.58 0.050 0.062 b 2.29 2.83 0.090 0.111 c 4.06 4.60 0.160 0.181 d 1.99 2.50 0.078 0.098 e 0.90 1.41 0.035 0.056 f 0.15 0.31 0.006 0.012 g 0.10 0.20 0.004 0.008 h 4.95 5.33 0.195 0.210 p/n = specific device code g = green compound yw = date code 4.43 package outline dimensions dim. unit(mm) unit(inch) marking diagram suggested pad layout unit(mm) 1.78 1.51 3.92 2.41
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